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昊量/auniontech 熱成像相機(jī)（8-14um）

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詳細(xì)介紹

高分辨非制冷熱紅外相機(jī)

高分辨非制冷紅外相機(jī)具有優(yōu)越的成像質(zhì)量，高溫度分辨率（0.05oC）以及準(zhǔn)確的溫度分析功能。這款高性能的熱成像相機(jī)帶有Cameralink或Gige接口。

該熱成像相機(jī)全幀頻50Hz（640×480），與工業(yè)標(biāo)準(zhǔn)Cameralink相配合，適合高速成像。并且，開窗模式下幀頻更高。

應(yīng)用：優(yōu)勢:

半導(dǎo)體檢測高靈敏度

NDT：熱像圖高分辨率

農(nóng)作物分析結(jié)構(gòu)緊湊

精確溫度測量接口兼容

質(zhì)量控制全幀頻高

實(shí)時過程控制

熱成像相機(jī)指標(biāo)參數(shù)：

Array type	Uncooled microbolometer (a-Si)
# pixels	640 (W) x 480 (H)
Pixel pitch	17 μm
Spectral band	8 μm to 14 μm
NETD	55 mK @ 30°C with F/1 lens
Array cooling	Uncooled
Pixel operability	> 99.5%*

Lens
Focal length	Various lenses available
Optical interface	Lens mount supporting multiple lenses
Imaging performance
Frame rate (full frame)	50 Hz
Window of interest	Minimum size 160 x 120 (shuttered)
Temperature stabilization	No ThermoElectric Cooling required (TEC-less)
Integration type	Rolling shutter
On-board image processing	NUC (Non-Uniformity Correction) Auto-offset and auto-gain with selectable region of interest XIE (Image Enhancement) Histogram equalization
On-board functionality	Self-starting, trigger possibilities, BIST (Build-In Self-Test), lifetime and power-on counter, test-pattern
A to D conversion resolution	16 bit
Interfaces
Camera control	CameraLink: XSP
Image acquisition	CameraLink
Trigger	In or out (configurable)
Power requirements
Power consumption	< 2 W
Power supply	12 V DC
Physical characteristics
Shock	40 g, 11 ms according to MIL-STD810G
Vibration	5 g (20 Hz to 2000 Hz) according to MIL-STD883J
Ambient operating temperature	- 40 °C to 60 °C (industrial components)
Storage temperature	- 45 °C to 85 °C (industrial components)
Dimensions	49 W x 49 H x 61.35 L mm3 (lens not included)
Weight camera head	208 g (lens not included)